Datasheets
Grade | MFI (g/10 min) | Flexural Modulus (ASTM D790, MPa) | Additive Package* | Processing technology | Additional information | Food approval?** | Technical datasheet | ||||
---|---|---|---|---|---|---|---|---|---|---|---|
HA31XTF | 3.50 | 1750.00 |
A
,
N
|
Extrusion Thermoforming | High stiffness, Good processability and transparency for Thin wall packaging (TWP) | Yes |